Wave Series™ Heat Sink

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The Wakefield-Vette Wave Series heat sink series are a superior choice for cooling BGA applications with limited height/footprint while achieving maximum surface area. The Wave Series heat sinks include a unique clipping mechanism that allows for superior heat transfer while securing the heat sink to the BGA itself. The clipping mechanism allows for easy installation in high production assembly.

Features and Benefits
Height: A low-profile design allows for more surface area in a height restricted application Clipping mechanism included with heat sink Easily compatible with major BGA device manufacturers' components such as: Broadcom, Motorola, Freescale, TI, Intel, and more		Approximately 12% better thermal performance than traditional footprint heat sinks Surface area: Fin array allows for more surface area for forced convection Easily customizable
Material Specifications
Heat sink: Aluminum alloy 6063-T5 with black anodized finish RoHS compliant		Spring clip: 304 stainless steel, 1.2 mm (0.47") diameter